DIRECT ACTIVE COOL™
DirectActiveCool is a next-generation active cooling solution designed for high-power AI, HPC, and data-center processors. It integrates a proprietary active thermal-management system inside a direct-to-chip (D2C) cold plate, improving heat transfer without increasing coolant flow or pump power.
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BUILT FOR 1 kW-CLASS AI & HPC PROCESSORS
DirectActiveCool™ is a next-generation active cooling solution for high-power AI, HPC, and data-center processors. It integrates a proprietary active thermal-management system inside a direct-to-chip (D2C) cold plate to boost heat transfer without increasing coolant flow or pump power—enabling lower cold-plate temperatures, higher rack density, and lower facility energy use.
Active microscale mixing inside the cold plate improves fluid-surface interaction to dramatically increase heat transfer.
Lower cold-plate temperatures with minimal pressure drop and lower coolant flow—reducing pump power and cooling energy.
Intelligent monitoring + adaptive control that tunes cooling performance to workload demand across deployments.