LISLE, IL – August 17, 2026 – Molex, a global electronics leader and connectivity innovator, today announced a strategic investment in CAEPlus, Inc., an early-stage company focused on the development of active liquid cooling technology designed to help data centers manage increasing heat loads driven by AI and High-Performance Computing (HPC) workloads. This investment advances Molex’s Data Center Thermal Management strategy by accelerating the innovation of CAEPlus’ BoundaryCool™ platform, a compact, active cooling architecture that addresses next gen GPU/ASIC thermal challenges.