HOW BoundaryCool™ WORKS ?

BoundaryCool™ Cold Plate Module (CPM) is an active direct-to-chip (D2C) single phase liquid-cooling technology designed for high-density AI/HPC processors. Unlike conventional Direct-to-Chip (D2C) cooling systems that rely solely on passive coolant flow, BoundaryCool™ introduces a proprietary active cooling method that enhances fluid-surface interaction at the microscale. This results in dramatically improved thermal performance (lower thermalresistance).