DGX INVIDIA
Power AI without limits. Our Direct Active Cooling technology keeps NVIDIA DGX systems cooler, faster, and more reliable even under the most intensive
STANDALONE
Our standalone Direct Active Cooling model is engineered for flexible deployment in high-performance AI and data center environments. Designed as a self-contained thermal management solution, it delivers efficient heat dissipation, stable operating temperatures, and optimized cooling performance for demanding computational workloads.
Designed for demanding environments such as NVIDIA DGX infrastructures and AI data centers, this integrated solution ensures stable operating temperatures, enhanced computational reliability, and superior energy efficiency under continuous heavy workloads.
INTERGRATED
Our integrated Direct Active Cooling model is engineered to deliver precision thermal management for next-generation AI and high-performance computing platforms. By combining direct-contact cooling plates, optimized fluid pathways, and high-efficiency heat exchange technology into a unified architecture, the system maximizes heat transfer while minimizing thermal resistance.
Designed for demanding environments such as NVIDIA DGX infrastructures and AI data centers, this integrated solution ensures stable operating temperatures, enhanced computational reliability, and superior energy efficiency under continuous heavy workloads.
With precision-engineered coolant pathways and direct-contact thermal transfer technology, the standalone architecture provides scalable, high-density cooling while simplifying integration, maintenance, and infrastructure expansion.